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Advantages of Laser Machining of Ceramic Substrates and Differences of Cutting with Different Light Sources
Published:
2022-11-14
Source:
The laser processing equipment used for ceramic PCB is mainly used for cutting and drilling. Since laser cutting has many technical advantages, it is widely used in the precision cutting industry. Let's see where the application advantages of laser cutting technology in PCB are.
The laser processing equipment used for ceramic PCB is mainly used for cutting and drilling. Since laser cutting has many technical advantages, it is widely used in the precision cutting industry. Let's see where the application advantages of laser cutting technology in PCB are.
Advantages and analysis of laser processing ceramic substrate PCB
Ceramic materials have good high-frequency and electrical properties, high thermal conductivity, chemical stability and thermal stability, and are ideal packaging materials for the production of large-scale integrated circuits and power electronic modules. Laser processing of ceramic substrate PCB is an important application technology in microelectronics industry. The technology is efficient, fast, accurate and has high application value.
Advantages of laser processing ceramic substrate PCB:
1. Because of the small laser spot, high energy density, good cutting quality and fast cutting speed;
2. Narrow slit, saving material;
3. Fine laser processing, smooth cutting surface without burrs;
4. The heat affected zone is small.
Compared with glass fiber board, ceramic substrate PCB is easy to break and requires high technology, so laser drilling technology is usually used.
Laser drilling technology has the advantages of high accuracy, fast speed, high efficiency, large-scale batch quantitative drilling, applicable to most hard and soft materials, and no loss of tools, meeting the requirements of high-density interconnection and fine development of printed circuit boards. The ceramic substrate with laser drilling process has the advantages of high bonding force between ceramic and metal, no shedding, bubbling, etc., which can achieve the effect of growing together, with high surface flatness and roughness of 0.1~0.3 μ m. The range of laser drilling aperture is 0.15-0.5mm, or even 0.06mm.
Differences in cutting ceramic substrates with different light sources (ultraviolet, green, infrared)
Difference 1:
The wavelength of infrared fiber laser cutting ceramic substrate is 1064nm, the wavelength of green light is 532nm, and the wavelength of ultraviolet light is 355nm.
Infrared fiber laser can achieve higher power and larger heat affected zone;
Green light is slightly better than fiber laser, and the heat affected zone is smaller;
Ultraviolet laser is a processing mode that destroys the molecular bonds of materials, and the heat affected zone is the smallest. This is also the reason why green light processing will have slight carbonization in the process of cutting non-metallic PCB, while ultraviolet laser can achieve very small carbonization, or even no carbonization.
Difference 2:
UV laser cutting machine can take into account FPC soft board cutting, IC chip cutting and some ultra-thin metal cutting in the PCB field, while high-power green laser cutting machine can only cut PCB hard boards in the PCB field. Although it can also cut FPC soft boards and IC chips, the cutting effect is far lower than that of UV laser.
As the ultraviolet laser cutting machine is a cold light source, the thermal effect is smaller and the effect is more ideal.
The cutting of PCB (non-metallic substrate, ceramic substrate) adopts galvanometer scanning mode to peel layer by layer to form the cutting. High power UV laser cutting machine has become the mainstream market in the PCB field.
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