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Ceramic substrate
Published:
2021-09-22
Source:
Ceramic substrate refers to a special process plate that copper foil is directly bonded to the surface of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate (single side or double side) at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can be etched with various patterns like PCB board, with great current carrying capacity.
Ceramic substrate refers to a special process plate that copper foil is directly bonded to the surface of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate (single side or double side) at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can be etched with various patterns like PCB board, with great current carrying capacity.
What are the types of ceramic substrates?
1、 By material
1、 Al2O3
Alumina substrate is the most commonly used substrate material in the electronic industry, with high strength and chemical stability, and rich sources of raw materials. It is suitable for various technical manufacturing and different shapes.
2、BeO
It has a higher thermal conductivity than aluminum metal, and is used in occasions where high thermal conductivity is required, but the temperature drops rapidly when it exceeds 300 ℃.
3 、AlN
AlN has two very important properties: high thermal conductivity and expansion coefficient matching with Si.
The disadvantage is that even a very thin oxide layer on the surface will affect the thermal conductivity.
To sum up, it can be seen that alumina ceramics are still in a leading position in the fields of microelectronics, power electronics, hybrid microelectronics, power modules, etc. due to their superior comprehensive performance.
2、 According to the manufacturing process
At present, there are five kinds of ceramic heat dissipation substrates: HTCC, LTCC, DBC, DPC and LAM. Among them, HTCC LTCC belongs to sintering process, and the cost will be higher.
1、HTCC
HTCC is also known as "high-temperature co fired multilayer ceramics". The manufacturing process is very similar to LTCC. The main difference is that the ceramic powder of HTCC is not added with glass material. HTCC must be dried and hardened at a high temperature of 1300~1600 ℃ to form embryos, and then drill through holes as well, fill holes and print lines with screen printing technology. Because of its high co firing temperature, the selection of metal conductor materials is limited. The main materials are tungsten, molybdenum, manganese and other metals with high melting point but poor conductivity, which are finally laminated and sintered.
2、 LTCC
LTCC is also known as low-temperature co fired multilayer ceramic substrate. In this technology, inorganic aluminum oxide powder and about 30%~50% of glass materials must be added with an organic binder to make them uniformly mixed into a muddy slurry; Then, the slurry is scraped into flakes with a scraper, and then the flake slurry is formed into flakes of raw embryos through a drying process; Then drill through holes according to the design of each layer as the signal transmission of each layer. The internal circuit of LTCC uses screen printing technology to fill holes and print circuits respectively on the green embryo. The internal and external electrodes can use silver, copper, gold and other metals respectively. Finally, each layer is laminated and placed in a sintering furnace at 850~900 ℃ for sintering.
3、DBC
DBC technology is a direct copper coating technology, which uses the oxygen containing eutectic liquid of copper to directly coat copper on ceramics. Its basic principle is to introduce an appropriate amount of oxygen element between copper and ceramics before or during the coating process. In the range of 1065 ℃~1083 ℃, copper and oxygen form Cu-O eutectic liquid. DBC technology uses this eutectic liquid to produce CuAlO2 or CuAl2O4 through chemical reaction with ceramic substrate on the one hand, and soak copper foil on the other hand, Realize the combination of ceramic substrate and copper plate.
4、DPC
DPC technology uses direct copper plating technology to deposit Cu on Al2O3 substrate. Its process combines material and film technology. Its product is the most commonly used ceramic heat dissipation substrate in recent years. However, its material control and process technology integration capabilities are required to be high, which makes the technical threshold for entering the DPC industry and stable production relatively high.
5、LAM
LAM technology is also called laser rapid activation metallization technology.
The above is a description of the classification of ceramic substrates shared by Xiaobian. I hope you have more understanding of ceramic substrates. In PCB proofing, ceramic substrate belongs to special board, which requires high technology and costs more than ordinary PCB. General PCB proofing factories find it troublesome to make, or they don't want to do it or rarely do it because of the small number of customer orders. Shenzhen Jieduobang is a PCB proofing manufacturer specializing in Rogers/Logers high frequency boards, which can meet various PCB proofing needs of customers; At this stage, Jieduobang uses ceramic substrates to apply in PCB proofing, which can achieve 4~6 layers of ceramic pure pressing; Mixed compaction of 4-8 layers.
Our company adopts HTCC technology to process the surface of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate (single side or double side).
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